Multi-Process Low-Damage and Low-Temperature Deposition and Etching System
Multiple plasma processes in one reactor. Combine ICPECVD, PEALD, ICP-RIE and ALE within a single reactor for maximum process flexibility.
Switch directly between deposition and etching processes without transferring the substrate between chambers. The proprietary PTSA ICP source delivers high plasma density with exceptionally low ion energy for low-damage processing.
A smaller footprint and lower cost of ownership than comparable multi-chamber cluster solutions.
The SENTECH SIPAR combines ICPECVD, PEALD, ICP-RIE and Atomic Layer Etching (ALE) within a single reactor platform. By integrating multiple plasma technologies into one process chamber, SIPAR enables seamless transitions between etching processes and deposition without breaking vacuum. The result is exceptional process flexibility, reduced contamination risk and efficient fabrication of advanced multilayer structures for semiconductor and materials research.
The SIPAR System supports a broad range of plasma deposition and etching processes for advanced materials research and semiconductor device fabrication. Thanks to its unique combination of ICPECVD, PEALD, ICP-RIE and Atomic Layer Etching (ALE) within a single reactor, the system enables highly flexible process integration for many different applications. PEALD can be used for processes such as Al₂O₃ passivation and post-etch critical recess treatments. ICPECVD enables the deposition of high-quality SiO₂ and Si₃N₄ films for hard masks, passivation layers and optical coatings. ICP-RIE supports applications including hBN etching, III-V compound recess etching and silicon nanostructuring, while ALE provides atomic-scale, low-damage etching for quantum devices and other process-sensitive applications. These examples represent only a small selection of the many materials, processes and applications supported.
The SIPAR has been designed to support rapid transitions between deposition and etching processes while maintaining highly stable process conditions. Its modular architecture combines advanced plasma hardware, intelligent vacuum management and the SIA operating software to provide reliable, repeatable plasma processing across multiple technologies.
While many SENTECH systems are single-chamber tools, each dedicated to a specific process type (e.g., ICP-RIE for etch, ICPECVD for deposition), cluster-style configurations can bring multiple modules together under shared vacuum handling, letting you do different processes in sequence without breaking vacuum.
In general, you will need electrical power, compressed air, purging nitrogen, cooling water and a process gas supply and exhaust. You will receive an installation manual with your system, which will outline all of the specific requirements of your purchased system. Our technical service team are available to offer support and answer questions.
SENTECH has an international network of distributors and technical service experts. We deliver globally, including Europe, Asia, Africa, North and South America. For more details on in-country representation, click here
SENTECH has a large team of application experts for both plasma process technology and thin film metrology. At our campus are two laboratories which are used to process and characterise customer samples, for system demonstrations and customer training. SENTECH offers application support for the lifecycle of your system. Learn more about our application support or contact the team.
Yes, SENTECH has two application labs in-house. You can contact our application team, who will share with you all the details and provide a sample analysis form for you to complete. Click here for further information and contact details.
Yes, SENTECH has a large network of technical service experts who offer in-country support for both plasma process technology and thin film metrology systems. Remote or on-site support is possible depending on your requirements. Click here to find out more or to contact the team.
SENTECH provides process modules that combine multiple processes, such as SIPAR for PECVD and PEALD, in a single reactor. The SI 500 ICP-RIE accommodates chlorine and fluorine-based etch chemistry in one process chamber. These configurations come with dedicated hardware, cleaning and conditioning recipes, as well as training. These solutions prioritise a smaller footprint and cost efficiency while maintaining practical process repeatability performance.
