Which plasma processes can I combine in one chamber?
SENTECH provides process modules that combine multiple processes, such as SIPAR for PECVD and PEALD, in a single reactor. The SI 500 ICP-RIE accommodates chlorine and fluorine-based etch chemistry in one process chamber. These configurations come with dedicated hardware, cleaning and conditioning recipes, as well as training. These solutions prioritise a smaller footprint and cost […]
Does SENTECH offer technical service support?
Yes, SENTECH has a large network of technical service experts who offer in-country support for both plasma process technology and thin film metrology systems. Remote or on-site support is possible depending on your requirements. Click here to find out more or to contact the team.
Can I send my samples to SENTECH for analysis?
Yes, SENTECH has two application labs in-house. You can contact our application team, who will share with you all the details and provide a sample analysis form for you to complete. Click here for further information and contact details.
Does SENTECH offer application support?
SENTECH has a large team of application experts for both plasma process technology and thin film metrology. At our campus are two laboratories which are used to process and characterise customer samples, for system demonstrations and customer training. SENTECH offers application support for the lifecycle of your system. Learn more about our application support or […]
Can you deliver systems SENTECH Plasma Systems internationally?
SENTECH has an international network of distributors and technical service experts. We deliver globally, including Europe, Asia, Africa, North and South America. For more details on in-country representation, click here
What kind of facility do I need to house a SENTECH Plasma System?
In general, you will need electrical power, compressed air, purging nitrogen, cooling water and a process gas supply and exhaust. You will receive an installation manual with your system, which will outline all of the specific requirements of your purchased system. Our technical service team are available to offer support and answer questions.
Can I combine different plasma processes without breaking vacuum?
While many SENTECH systems are single-chamber tools, each dedicated to a specific process type (e.g., ICP-RIE for etch, ICPECVD for deposition), cluster-style configurations can bring multiple modules together under shared vacuum handling, letting you do different processes in sequence without breaking vacuum.
Depolab 200
Plasma-enhanced chemical vapour deposition (PECVD) tool Open lid loading For up to 200 mm wafers Substrate temperature up to 400 °C Optional low-frequency mixing for low-stress films Dry pumping unit Small footprint
Depolab 200 PECVD Open Lid System
The Depolab 200 is the basic plasma-enhanced chemical vapour deposition (PECVD) system suited to the deposition of dielectric films for etching masks, membranes, and electrically isolating films as well as many others.