SILAYO PEALD System for Optical Coatings on Large Substrates

The SENTECH SILAYO is a plasma-enhanced atomic layer deposition (PEALD) system for optical coatings and extends the SENTECH PECVD and ALD product portfolio.

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Dekoratives Bild

Key features & benefits

PEALD for best thin film uniformity < 1 %

The SENTECH SILAYO plasma enhanced atomic layer deposition (PEALD) system is designed for conformal and homogeneous optical coatings on large 3D objects and on batches of small substrates. The SENTECH proprietary Planar Triple Spiral Antenna (PTSA) provides a homogeneous plasma for homogeneous optical coatings.

Samples up to 330 mm diameter and 100 mm height

The SENTECH SILAYO PEALD system enables homogeneously coating samples up to 330 mm in diameter and a vertical dimension of up to 100 mm.

Stress control using rf bias

The optional rf-biased substrate electrode allows the modification of the layer properties (e.g. stress and refractive index).

SENTECH SILAYO

The SENTECH SILAYO PEALD system extends the SENTECH ALD and PEALD product portfolio to deposition on 330 mm substrates and 3D substrates. In order to ensure excellent uniformity and conformality in layer-thickness PEALD is used for depositing optical thin films applied as e.g., anti-reflective coatings or optical filter systems. The SENTECH SILAYO uses the advantages of the SENTECH Planar Triple Spiral Antenna (PTSA) inductively coupled plasma (ICP) source in PEALD processing.

Flexibility and modularity

The SENTECH SILAYO PEALD system is designed for depositing materials on large and 3D-shaped substrates, especially for optical coatings with high requirements on layer performance such as, high precision in thickness and composition control, smooth surfaces and sharp interfaces,stress control, especially for high-thickness multilayer stacks,high uniformity and conformality on 3D shapes and, reduced deposition temperatures for low-damage processing.

The system can optionally be equipped with the proprietary technology of the SENTECH AL Real Time Monitor for in-situ monitoring.

The SENTECH SILAYO is controlled by the advanced hardware and SENTECH SIA software, with a client-server architecture. A well-proven, reliable progammable logic controller (PLC) is used for the real-time control of all components.

While many SENTECH systems are single-chamber tools, each dedicated to a specific process type (e.g., ICP-RIE for etch, ICPECVD for deposition), cluster-style configurations can bring multiple modules together under shared vacuum handling, letting you do different processes in sequence without breaking vacuum.

In general, you will need electrical power, compressed air, purging nitrogen, cooling water and a process gas supply and exhaust. You will receive an installation manual with your system, which will outline all of the specific requirements of your purchased system. Our technical service team are available to offer support and answer questions.

SENTECH has an international network of distributors and technical service experts. We deliver globally, including Europe, Asia, Africa, North and South America. For more details on in-country representation, click here

SENTECH has a large team of application experts for both plasma process technology and thin film metrology. At our campus are two laboratories which are used to process and characterise customer samples, for system demonstrations and customer training. SENTECH offers application support for the lifecycle of your system. Learn more about our application support or contact the team.

Yes, SENTECH has two application labs in-house. You can contact our application team, who will share with you all the details and provide a sample analysis form for you to complete. Click here for further information and contact details.

Yes, SENTECH has a large network of technical service experts who offer in-country support for both plasma process technology and thin film metrology systems. Remote or on-site support is possible depending on your requirements. Click here to find out more or to contact the team.

SENTECH provides process modules that combine multiple processes, such as SIPAR for PECVD and PEALD, in a single reactor. The SI 500 ICP-RIE accommodates chlorine and fluorine-based etch chemistry in one process chamber. These configurations come with dedicated hardware, cleaning and conditioning recipes, as well as training. These solutions prioritise a smaller footprint and cost efficiency while maintaining practical process repeatability performance.

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