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SI 591 compact RIE Plasma System

The SENTECH SI 591 compact RIE Plasma Etch system with load lock is a compact solution for chlorine and fluorine-based RIE.

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Key features & benefits

Process flexibility

The SENTECH SI 591 compact RIE Plasma Etch system facilitates a large number of chlorine and fluorine-based plasma etch processes.

Small footprint and high modularity

The system can be configured as a single reactor or as a cluster tool with cassette-to-cassette loading. The configurations of the single reactor are with a load lock above the system for minimal footprint or with a load lock for through-the-wall installation.

SENTECH control software

SENTECH Plasma Etch tools include user-friendly powerful software with GUI, parameter window, recipe editor, data logging, and user management.

SI 591 Compact

The SENTECH SI 591 compact RIE Plasma Etch system stands for excellent process reproducibility and plasma etching process flexibility due to the vacuum load lock and fully computer-controlled plasma etch process conditions. Flexibility, modularity, and a small footprint are design characteristics of the SENTECH SI 591 compact. Samples up to 200 mm in diameter and carriers can be loaded. The system can be configured for through-the-wall operation or minimal footprint with multiple options.

Flexibility and modularity

The SENTECH SI 591 compact RIE Plasma Etch system combines the advantages of a parallel plate electrode design for RIE with the fully computer-controlled etch process conditions of a load lock system. The system can be configured for processing a variety of materials.

At SENTECH we offer different levels of automation ranging from vacuum cassette loading to one process chamber up to six port cluster with different etch and deposition modules targeted to high flexibility or high throughput. The SENTECH SI 591 compact system is available as a process module on a cluster configuration as well.

The system is controlled by advanced hardware and SIA operating software, with a client-server architecture. A well-proven, reliable programmable logic controller (PLC) is used for the real-time control of all components.

Configurations

SI 591 compact

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  • RIE plasma etching with small footprint
  • Load lock
  • Corrosive and non-corrosive chemistry
  • For up to 200 mm wafers
  • Diagnostic windows for laser interferometer and OES

SI 591 cluster

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  • Configurations of up to 6-port transfer chamber available
  • Combination of RIE, ICP-RIE, PECVD, and ALD
  • Manual vacuum load lock or cassette station
  • Cluster for R & D and high throughput
  • SENTECH control software

SI 591 reverse

  • RIE plasma etch with a small footprint
  • Load lock for through-the-wall integration
  • Halogen and fluorine chemistry
  • For up to 200 mm wafers
  • Diagnostic windows for laser interferometer and OES

SENTECH offer plasma etching systems to facilitate reactive ion etching (RIE), low-damage inductively coupled reactive ion etching (ICP-RIE), deep reactive ion etching (DRIE), cryogenic etching and low-damage atomic layer etching.

While many SENTECH systems are single-chamber tools, each dedicated to a specific process type (e.g., ICP-RIE for etch, ICPECVD for deposition), cluster-style configurations can bring multiple modules together under shared vacuum handling, letting you do different processes in sequence without breaking vacuum.

In general, you will need electrical power, compressed air, purging nitrogen, cooling water and a process gas supply and exhaust. You will receive an installation manual with your system, which will outline all of the specific requirements of your purchased system. Our technical service team are available to offer support and answer questions.

SENTECH has an international network of distributors and technical service experts. We deliver globally, including Europe, Asia, Africa, North and South America. For more details on in-country representation, click here

SENTECH has a large team of application experts for both plasma process technology and thin film metrology. At our campus are two laboratories which are used to process and characterise customer samples, for system demonstrations and customer training. SENTECH offers application support for the lifecycle of your system. Learn more about our application support or contact the team.

Yes, SENTECH has two application labs in-house. You can contact our application team, who will share with you all the details and provide a sample analysis form for you to complete. Click here for further information and contact details.

Yes, SENTECH has a large network of technical service experts who offer in-country support for both plasma process technology and thin film metrology systems. Remote or on-site support is possible depending on your requirements. Click here to find out more or to contact the team.

SENTECH provides process modules that combine multiple processes, such as SIPAR for PECVD and PEALD, in a single reactor. The SI 500 ICP-RIE accommodates chlorine and fluorine-based etch chemistry in one process chamber. These configurations come with dedicated hardware, cleaning and conditioning recipes, as well as training. These solutions prioritise a smaller footprint and cost efficiency while maintaining practical process repeatability performance.

Reactive Ion Etching (RIE) combines chemical etching with physical ion bombardment to deliver precise pattern transfer. In RIE systems, a plasma is generated between two electrodes using a radio frequency (RF) power source. Reactive species chemically react with the substrate surface while positive ions accelerate toward it, physically sputtering atoms away. Learn more about plasma etching processes.

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