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SI PEALD Plasma-Enhanced Atomic Layer Deposition System

The SENTECH SI PEALD enables homogenous and conformal coating of sensitive substrates and layers at low temperatures. A high flux of reactive gas species is provided at the sample surface without UV radiation or ion bombardment.

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Key features & benefits

PEALD for sensitive substrates

The SENTECH SI PEALD system with true remote plasma source enables homogenous and conformal coating of sensitive substrates and layers at low temperatures <100 °C. A high flux of reactive gas species is provided at the sample surface without UV radiation or ion bombardment.

Atomic layer deposition (ALD) for precise, conformal, and uniform deposition

The ALD deposition technique is characterised by its ability to deposit conformal and uniform films with precise control over thickness at the atomic level and continues to play a growing role in semiconductor devices such as the deposition of high-k dielectric materials. Some of the primary applications of ALD include sensors, optoelectronics and 2D materials.

In-situ diagnostics for process development and optimisation

In-situ diagnostics by the AL Real Time Monitor enables ultra-high resolution of single ALD cycles. The advantages are confirmation of the ALD regime, reduction of process time, and total cost of ownership. Spectroscopic ellipsometry is provided as in-situ diagnostics, too, having specific advantages for our atomic layer deposition systems.

Easy reactor cleaning

Regular reactor cleaning is essential for stable and repeatable atomic layer deposition processing. The reactor chamber is easily opened with the help of a lifting device for cleaning our atomic layer deposition systems.

Cluster integration

Atomic layer deposition systems are available as modules for SENTECH Cluster Tools. Our atomic layer deposition systems can be combined with SENTECH PECVD and etch systems for industrial applications. Cluster tools optionally feature cassette-to-cassette loading.

Glove box system integration

SENTECH ALD Systems are compatible with glove boxes from various suppliers.

SENTECH SI PEALD System

SENTECH ALD Systems enable thermal and plasma-enhanced operation. Our ALD systems can be configured for oxide, nitride, 2D material deposition. 3D structures can be homogenously and conformally coated. With ALD, PECVD, and ICPECVD, SENTECH offers plasma deposition technology for depositing films from the nanometer scale up to several microns.

PEALD for sensitive substrates

  • Polymer foils
  • Organic films
  • Organic devices

Flexibility and modularity

SENTECH ALD Systems allow the combination of different thermal and/or plasma-enhanced ALD films to multilayer structures. Thermal and plasma-enhanced atomic layer deposition (PEALD) is supported in one reactor with an optimal shutter.

SENTECH offers leading-edge, ultra-fast, in-situ monitoring of layer-by-layer film growth using the AL Real Time Monitor as well as wide-range spectroscopic ellipsometry.

Configurations

SI PEALD

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  • Load lock
  • True remote plasma source
  • Low-temperature processing using true remote plasma-enhanced ALD
  • Lifting device for opening reactor
  • Compatible with cluster integration

SI ALD

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  • Load lock
  • Thermal ALD processing
  • Upgradable with the True Remote CCP plasma source
  • Compatible with cluster integration

Glove Box Integration

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  • For systems with load lock
  • Glove box from various suppliers available

Plasma Source

SENTECH SI PEALD with PTSA ICP Source

Designed with a modular plasma configuration, the system allows operation with the  True Remote CCP source or the PTSA ICP source, depending on user process requirements.

Cluster Configuration

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  • PEALD module is compatible for 3 to 6 port cluster configurations
  • Can combine with ICPECVD, ALE and ICP-RIE modules

While many SENTECH systems are single-chamber tools, each dedicated to a specific process type (e.g., ICP-RIE for etch, ICPECVD for deposition), cluster-style configurations can bring multiple modules together under shared vacuum handling, letting you do different processes in sequence without breaking vacuum.

In general, you will need electrical power, compressed air, purging nitrogen, cooling water and a process gas supply and exhaust. You will receive an installation manual with your system, which will outline all of the specific requirements of your purchased system. Our technical service team are available to offer support and answer questions.

SENTECH has an international network of distributors and technical service experts. We deliver globally, including Europe, Asia, Africa, North and South America. For more details on in-country representation, click here

SENTECH has a large team of application experts for both plasma process technology and thin film metrology. At our campus are two laboratories which are used to process and characterise customer samples, for system demonstrations and customer training. SENTECH offers application support for the lifecycle of your system. Learn more about our application support or contact the team.

Yes, SENTECH has two application labs in-house. You can contact our application team, who will share with you all the details and provide a sample analysis form for you to complete. Click here for further information and contact details.

SENTECH provides process modules that combine multiple processes, such as SIPAR for PECVD and PEALD, in a single reactor. The SI 500 ICP-RIE accommodates chlorine and fluorine-based etch chemistry in one process chamber. These configurations come with dedicated hardware, cleaning and conditioning recipes, as well as training. These solutions prioritise a smaller footprint and cost efficiency while maintaining practical process repeatability performance.

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