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Etchlab 200 RIE Open Lid Plasma System

The RIE plasma etching system Etchlab 200 features the benefits of cost-effective direct loading.

Key features & benefits

RIE Plasma Etching with the SENTECH Etchlab 200 system represents a family of direct load plasma etch systems, combining the advantages of a parallel plate electrode design with the cost effective design of direct load.

Cost-effectiveness

The system combines parallel plate plasma source design with direct load.

Upgradeability

According to its modular design, the SENTECH Etchlab 200 RIE system is upgradeable with end point detection, larger pumping unit, vacuum load lock, and additional gas lines.

SENTECH control software

This system is equipped with a user-friendly powerful software with GUI, parameter window, recipe editor, data logging, user management.

The SENTECH Etchlab 200 RIE Plasma Etch system represents a family of direct-load plasma etch tools combining the advantages of a parallel plate electrode design for RIE with the cost-effective design of direct load. The system features simple and fast sample loading from parts to 200 mm or 300 mm diameter wafer directly onto the electrode or on a carrier. Flexibility, modularity, and a small footprint are design characteristics of the SENTECH Etchlab 200 RIE system. Diagnostic windows located at the top electrode and the reactor can easily accommodate the SENTECH Laser Interferometer or OES tools.

Flexibility and modularity

The SENTECH Etchlab 200 RIE Plasma Etch system can be configured for processing of materials that are compatible with wafer direct loading, including but not limited to silicon and silicon compounds, compound semiconductors, dielectrics, and polymers and metals.

The SENTECH Etchlab 200 RIE Plasma Etch system is controlled by advanced hardware and SIA operating software, with a client-server architecture. A well-proven, reliable programmable logic controller (PLC) is used for the real-time control of all components.