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Etchlab 200 RIE Open Lid Plasma System

The RIE plasma etching system Etchlab 200 features the benefits of cost-effective direct loading.

Key features & benefits

RIE Plasma Etching with the SENTECH Etchlab 200 system represents a family of direct load plasma etch systems, combining the advantages of a parallel plate electrode design with the cost effective design of direct load.

Cost-effectiveness

The system combines parallel plate plasma source design with direct load.

Upgradeability

According to its modular design, the SENTECH Etchlab 200 RIE system is upgradeable with end point detection, larger pumping unit, vacuum load lock, and additional gas lines.

SENTECH control software

This system is equipped with a user-friendly powerful software with GUI, parameter window, recipe editor, data logging, user management.

The SENTECH Etchlab 200 RIE Plasma Etch system represents a family of direct-load plasma etch tools combining the advantages of a parallel plate electrode design for RIE with the cost-effective design of direct load. The system features simple and fast sample loading from parts to 200 mm or 300 mm diameter wafer directly onto the electrode or on a carrier. Flexibility, modularity, and a small footprint are design characteristics of the SENTECH Etchlab 200 RIE system. Diagnostic windows located at the top electrode and the reactor can easily accommodate the SENTECH Laser Interferometer or OES tools.

Flexibility and modularity

The SENTECH Etchlab 200 RIE Plasma Etch system can be configured for processing of materials that are compatible with wafer direct loading, including but not limited to silicon and silicon compounds, compound semiconductors, dielectrics, and polymers and metals.

The SENTECH Etchlab 200 RIE Plasma Etch system is controlled by advanced hardware and SIA operating software, with a client-server architecture. A well-proven, reliable programmable logic controller (PLC) is used for the real-time control of all components.

Configurations

Etchlab 200

RIE plasma etch system
Open lid
For up to 200 mm wafers
Diagnostic windows for laser interferometer and OES

Etchlab 380

RIE plasma etcher
Open lid
For up to 300 mm wafers
Diagnostic windows for laser interferometer and OES

FAQ | What is plasma etching? Learn more about plasma etching processes

Plasma etching enables the precise removal of materials from a substrate through chemical and physical reactions driven by ionised gases. Unlike traditional wet etching, which uses liquid chemicals and often produces isotropic profiles, plasma etching provides anisotropic, highly controlled material removal. For more information, click here.

FAQ | Can I combine different plasma processes without breaking vacuum?

While many SENTECH systems are single-chamber tools, each dedicated to a specific process type (e.g., ICP-RIE for etch, ICPECVD for deposition), cluster-style configurations can bring multiple modules together under shared vacuum handling, letting you do different processes in sequence without breaking vacuum.

FAQ | What kind of facility do I need to house a SENTECH Plasma System?

In general, you will need electrical power, compressed air, purging nitrogen, cooling water and a process gas supply and exhaust. You will receive an installation manual with your system, which will outline all of the specific requirements of your purchased system. Our technical service team are available to offer support and answer questions.

FAQ | Can you deliver systems SENTECH Plasma Systems internationally?

SENTECH has an international network of distributors and technical service experts. We deliver globally, including Europe, Asia, Africa, North and South America. For more details on in-country representation, click here

FAQ | Does SENTECH offer application support?

SENTECH has a large team of application experts for both plasma process technology and thin film metrology. At our campus are two laboratories which are used to process and characterise customer samples, for system demonstrations and customer training. SENTECH offers application support for the lifecycle of your system. Learn more about our application support or contact the team.

FAQ | Can I send my samples to SENTECH for analysis?

Yes, SENTECH has two application labs in-house. You can contact our application team, who will share with you all the details and provide a sample analysis form for you to complete. Click here for further information and contact details.

FAQ | Does SENTECH offer technical service support?

Yes, SENTECH has a large network of technical service experts who offer in-country support for both plasma process technology and thin film metrology systems. Remote or on-site support is possible depending on your requirements. Click here to find out more or to contact the team.

FAQ | Which plasma processes can I combine in one chamber?

SENTECH provides process modules that combine multiple processes, such as SIPAR for PECVD and PEALD, in a single reactor. The SI 500 ICP-RIE accommodates chlorine and fluorine-based etch chemistry in one process chamber. These configurations come with dedicated hardware, cleaning and conditioning recipes, as well as training. These solutions prioritise a smaller footprint and cost efficiency while maintaining practical process repeatability performance.

FAQ | What is reactive ion etching (RIE)?

Reactive Ion Etching (RIE) combines chemical etching with physical ion bombardment to deliver precise pattern transfer. In RIE systems, a plasma is generated between two electrodes using a radio frequency (RF) power source. Reactive species chemically react with the substrate surface while positive ions accelerate toward it, physically sputtering atoms away. Learn more about plasma etching processes.