Depolab 200 PECVD Open Lid System

The Depolab 200 is the basic plasma-enhanced chemical vapour deposition (PECVD) system suited to the deposition of dielectric films for etching masks, membranes, and electrically isolating films as well as many others.

Dekoratives Bild
Dekoratives Bild

Key features & benefits

The SENTECH Depolab 200 is a cost-effective plasma-enhanced chemical vapour deposition (PECVD) system combining the advantages of a parallel plate electrode design for uniform film deposition with the flexible direct load design. Starting with standard applications on 2” to 200 mm wafers and sample pieces.

Cost-effectiveness

The system combines parallel plate plasma source design with direct load.

Upgradeability

According to its modular design, the SENTECH Depolab 200 is upgradeable with a larger pumping unit, low-frequency power supply for stress control, and additional gas lines.

Operating software

User-friendly powerful software is included with GUI, parameter window, recipe editor, data logging, and user management.

SENTECH Depolab 200

The SENTECH Depolab 200 PECVD system features a robust design, reliability, and flexible software and hardware. Different processes have been developed on the system e. g. for high-quality silicon nitride and silicon oxide layer deposition. The system comprises the reactor unit with gas box, control electronics, computer, backing pump, and main connection box.

Flexibility and modularity

The SENTECH Depolab 200 PECVD System is configured to deposit SiO2 , SiNx, SiONx, and a-Si films in a temperature range up to 400 °C. The system is especially suited for the deposition of dielectric films for etching masks, membranes, electrically isolating films, and others. The SENTECH Depolab 200 is controlled by advanced hardware and SIA operating software, with a client-server architecture. A well-proven, reliable programmable logic controller (PLC) is used for the real-time control of all components.

Configurations

While many SENTECH systems are single-chamber tools, each dedicated to a specific process type (e.g., ICP-RIE for etch, ICPECVD for deposition), cluster-style configurations can bring multiple modules together under shared vacuum handling, letting you do different processes in sequence without breaking vacuum.

In general, you will need electrical power, compressed air, purging nitrogen, cooling water and a process gas supply and exhaust. You will receive an installation manual with your system, which will outline all of the specific requirements of your purchased system. Our technical service team are available to offer support and answer questions.

SENTECH has an international network of distributors and technical service experts. We deliver globally, including Europe, Asia, Africa, North and South America. For more details on in-country representation, click here

SENTECH has a large team of application experts for both plasma process technology and thin film metrology. At our campus are two laboratories which are used to process and characterise customer samples, for system demonstrations and customer training. SENTECH offers application support for the lifecycle of your system. Learn more about our application support or contact the team.

Yes, SENTECH has two application labs in-house. You can contact our application team, who will share with you all the details and provide a sample analysis form for you to complete. Click here for further information and contact details.

Yes, SENTECH has a large network of technical service experts who offer in-country support for both plasma process technology and thin film metrology systems. Remote or on-site support is possible depending on your requirements. Click here to find out more or to contact the team.

SENTECH provides process modules that combine multiple processes, such as SIPAR for PECVD and PEALD, in a single reactor. The SI 500 ICP-RIE accommodates chlorine and fluorine-based etch chemistry in one process chamber. These configurations come with dedicated hardware, cleaning and conditioning recipes, as well as training. These solutions prioritise a smaller footprint and cost efficiency while maintaining practical process repeatability performance.

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