- Cryogenic ICP plasma etch system with automatic switching unit for comfortable change between cryogenic etch and room temperature processing
- With vacuum load lock
- Substrate temperature from -150 °C to 80 °C (LN2 cooling)
- Substrate temperature -10 °C to 150 °C for room temperature processing with circulation chiller
- Products
Plasma Process Technology
Plasma Process Technology
Low-damage plasma etch and deposition systems from SENTECH
Thin Film Metrology
Thin Film Metrology
SENTECH thin film metrology tools for repeatable and accurate results
- Application and Industries
Application and Industries
Leading-edge application capabilities from SENTECH
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Company
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Customer Support
SENTECH Sales, Application and Technical Service support