- 200 mm or 300 mm x-y mapping stage
- Extended spectral range to the NIR
- Reduced spot size optics, allows measurement inside squares less than 90 μm
- Option to measure wafer bow and stress
- Software interface to MES using SEC/GEM protocol
- Products
Plasma Process Technology
Plasma Process Technology
Low-damage plasma etch and deposition systems from SENTECH
Thin Film Metrology
Thin Film Metrology
SENTECH thin film metrology tools for repeatable and accurate results
- Application and Industries
Application and Industries
Leading-edge application capabilities from SENTECH
- Company
Company
About SENTECH, news and events
- Careers
- Customer Support
Customer Support
SENTECH Sales, Application and Technical Service support