Al Real Time Monitor Laser Ellipsometer
The SENTECH AL Real Time Monitor is a proven optical diagnostic tool allowing fast process development with ultra-high resolution of single ALD and ALE cycles.
RM 1000 and RM 2000 Spectroscopic Reflectometry Tools
The spectroscopic reflectometry using the RM 1000/2000 features UV to NIR spectral range from 200 nm – 1000 nm. The optical layout is optimised for light throughput for reliable measurements of n and k even on rough or curved surfaces and with precise height and tilt adjustment.
SILAYO PEALD System for Optical Coatings on Large Substrates
The SENTECH SILAYO is a plasma-enhanced atomic layer deposition (PEALD) system for optical coatings and extends the SENTECH PECVD and ALD product portfolio.
SE 400adv Multiple-Angle Laser Ellipsometer
The laser ellipsometer SE 400adv measures thickness and refractive index of transparent thin films, featuring measurement speed, Sub-Angstrom precision in thickness, and per mille accuracy in refractive index determination.
SE 500adv Combined Ellipsometry Reflectometry
The SE 500adv combines ellipsometry and reflectometry to eliminate the ambiguity of measuring layer thickness of transparent films.
SI PEALD Plasma-Enhanced Atomic Layer Deposition System
The SENTECH SI PEALD enables homogenous and conformal coating of sensitive substrates and layers at low temperatures. A high flux of reactive gas species is provided at the sample surface without UV radiation or ion bombardment.
Depolab 200 PECVD Open Lid System
The Depolab 200 is the basic plasma-enhanced chemical vapour deposition (PECVD) system suited to the deposition of dielectric films for etching masks, membranes, and electrically isolating films as well as many others.
SI 500 D ICPECVD System
Inductively coupled (IC) PECVD system, the SENTECH SI 500 D for high density, low ion energy, and low-pressure plasma deposition of dielectric films and low-damage, low-temperature deposition for passivation layers.
Cluster Configuration for Plasma Etching and Deposition
SENTECH Cluster Tools comprise plasma etching and / or deposition modules, transfer chamber and vacuum load lock or cassette station for flexibiliy in wafer handling.