Which plasma processes can I combine in one chamber?
SENTECH provides process modules that combine multiple processes, such as SIPAR for PECVD and PEALD, in a single reactor. The SI 500 ICP-RIE accommodates chlorine and fluorine-based etch chemistry in one process chamber. These configurations come with dedicated hardware, cleaning and conditioning recipes, as well as training. These solutions prioritise a smaller footprint and cost […]
Does SENTECH offer technical service support?
Yes, SENTECH has a large network of technical service experts who offer in-country support for both plasma process technology and thin film metrology systems. Remote or on-site support is possible depending on your requirements. Click here to find out more or to contact the team.
Can I send my samples to SENTECH for analysis?
Yes, SENTECH has two application labs in-house. You can contact our application team, who will share with you all the details and provide a sample analysis form for you to complete. Click here for further information and contact details.
Does SENTECH offer application support?
SENTECH has a large team of application experts for both plasma process technology and thin film metrology. At our campus are two laboratories which are used to process and characterise customer samples, for system demonstrations and customer training. SENTECH offers application support for the lifecycle of your system. Learn more about our application support or […]
Can I combine different plasma processes without breaking vacuum?
While many SENTECH systems are single-chamber tools, each dedicated to a specific process type (e.g., ICP-RIE for etch, ICPECVD for deposition), cluster-style configurations can bring multiple modules together under shared vacuum handling, letting you do different processes in sequence without breaking vacuum.
Which plasma etching processes can SENTECH Systems carry out?
SENTECH offer plasma etching systems to facilitate reactive ion etching (RIE), low-damage inductively coupled reactive ion etching (ICP-RIE), deep reactive ion etching (DRIE), cryogenic etching and low-damage atomic layer etching.
SENTECH Cluster Configuration Brochure
Cluster for industry
High-throughput cluster for production This example is configured with two cassette stations, 3 inductively coupled plasma (ICP) process modules and one port for later upgrading to add a further process module.
Research and development cluster
Flexibility using carrier handling (pieces, 100 mm, 150 mm, 200 mm) Combining processes without breaking vacuum Multiple process modules for ICP-RIE, ALE, DRIE, cryo etching, ICPECVD, and PEALD Separating chemically incompatible processes
Cluster Configuration for Plasma Etching and Deposition
SENTECH Cluster Tools comprise plasma etching and / or deposition modules, transfer chamber and vacuum load lock or cassette station for flexibility in wafer handling.