Key features & benefits
Semiautomated tabletop quality control
The SENTECH RM 1000 QC is an optical reflectometer for quality control of thin films and bulk materials on patterned substrates. It is ideal for random sampling, tool qualification, and statistical process control (SPC) in small-scale and large-scale production.
Quality control on patterned wafers with manual wafer handling
The SENTECH RM 1000 QC is easy-loaded manually. Then, pattern recognition, mapping measurement, analysis, and reporting results and statistics are fully automated for patterned 200 mm wafers.
Integration into lab and fab environment
The SENTECH RM 1000 QC optionally is integrated into a manufacturing execution system via SECS/GEM.
The SENTECH RM 1000 QC reflectometer is designed for fast and easy thickness measurement of transparent and semi-transparent films on transparent or absorbing substrates for quality control within industrial production processes. The tool covers a film thickness range of 20 nm to 50 μm and can be applied in < 100 µm test patterns.
Flexibility and modularity
The SENTECH RM 1000 QC spectroscopic reflectometer provides reflectivity spectra at normal incidence that are analysed by the SENTECH SpectraRay/4 software for parameters including film thickness, absorption, composition, energy gap, colour, and spectral bandwidth. Pattern recognition is used for measuring structured samples.
The tool has an extremely straightforward operation flow, simply place the wafer, start the automated process, and the tool will return accurate pattern recognition, measurement and mapping, and precise, repeatable statistical results.
SpectraRay/4 is the comprehensive spectroscopic ellipsometer software for the SENTECH RM 1000 QC. It comprises two modes of operation: The recipe mode and the interactive mode. The recipe mode allows for easy execution of routine applications. The interactive mode guides the ellipsometric measurement through an interactive graphical user interface.
Configurations:
- 200 mm or 300 mm x-y mapping stage
- Extended spectral range to the NIR
- Reduced spot size optics, allows measurement inside squares less than 90 μm
- Option to measure wafer bow and stress
- Software interface to MES using SEC/GEM protocol
