Plasma Etching

Discover the SENTECH modular and flexible ICP-RIE processing systems for low-damage, high-rate, and high-selectivity inductively coupled plasma (ICP) etching.

Plasma etch systems

ICP-RIE Plasma Etch System – SI 500

The SENTECH SI 500 ICP-RIE high-end plasma etch system uses an inductively coupled plasma (ICP) source with low ion energy for low-damage etch and nanostructuring.

Cryogenic ICP-RIE Plasma Etch System – SI 500 C

The SI 500 C represents the leading edge for inductively coupled plasma (ICP) processing designed for cryogenic etching.

RIE Open Lid Plasma Etch System – Etchlab 200

The plasma etching system Etchlab 200 features the benefits of cost-effective direct loading for RIE.

RIE Plasma Etch System with Small Footprint – SI 591 compact

The SENTECH SI 591 compact RIE Plasma Etch system with load lock is a compact solution for chlorine and fluorine-based RIE.

RIE Plasma Etch System with He Backside Cooling – SI 500 CCP

A conductively coupled plasma etch tool with Helium backside cooling for processing of substrates in RIE mode.

Plasma Process Technology

PECVD
Systems

Atomic Layer Deposition

Cluster
Configuration

News

Wafer-level integration challenges of ALD for 2D materials

Find out about the collaboration between SENTECH and the Ruhr-Universität Bochum (RUB).

Analysing the earth’s heat balance to better understand global warming

The European Space Agency's satellite mission planned for 2027.

The SENTECH “Plasma Process Technology Seminar” 2024

Click here to find out more about the SENTECH Plasma Process Technology Seminar.

The SENTECH Thin Film Metrology Seminar and Workshop

Read the full article to find out more about the seminar.

SENTECH set to expand sales and service offerings in Spain

Welcome to the SENTECH team Izasa Scientific