PECVD Systems

Gain insight into our systems with low-damage, low-temperature capabilities for inductively coupled plasma-based CVD deposition processes.

Plasma-enhanced chemical vapour deposition tools

ICPECVD System – SI 500 D

Inductively coupled plasma (ICP) deposition system, the SENTECH SI 500 D for high density, low ion energy, and low-pressure plasma deposition of dielectric films and low-damage, low-temperature deposition for passivation layers.

PECVD Open Lid Plasma Deposition System – Depolab 200

The SENTECH Depolab 200 is the basic plasma-enhanced chemical vapour deposition (PECVD) system suited to the deposition of dielectric films for etching masks, membranes, and electrically isolating films as well as many others.

ICP Deposition System combining PECVD and ALD in one Reactor – SIPAR

The inductively coupled plasma (ICP) deposition system SIPAR combines plasma-enhanced chemical vapour deposition (PECVD) and atomic layer deposition (ALD) in one Reactor.

Plasma Process Technology

Plasma
Etching

Atomic Layer Deposition

Cluster
Configuration

News

Wafer-level integration challenges of ALD for 2D materials

Find out about the collaboration between SENTECH and the Ruhr-Universität Bochum (RUB).

Analysing the earth’s heat balance to better understand global warming

The European Space Agency's satellite mission planned for 2027.

The SENTECH “Plasma Process Technology Seminar” 2024

Click here to find out more about the SENTECH Plasma Process Technology Seminar.

The SENTECH Thin Film Metrology Seminar and Workshop

Read the full article to find out more about the seminar.

SENTECH set to expand sales and service offerings in Spain

Welcome to the SENTECH team Izasa Scientific