Key features & benefits
High yield and high throughput
Plasma etch and deposition modules can be combined with up to two cassette stations for increased repeatability, high yield, and high throughput processing of up to 200 mm wafers.
Flexible process configuration
Three to six port transfer chambers are available for clustering ICP plasma etch systems, RIE etch systems, atomic layer deposition systems, and ICPECVD deposition tools to meet the requirements of research & development and production. Samples can be loaded via a vacuum load lock and/or a vacuum cassette station.
Flexible carrier handling
SENTECH Cluster Configurations are suitable for processing different wafer sizes without hardware changes using carriers allowing for He-backside cooling. Wafer cassettes of different pitch are also interchangeable
SENTECH Cluster Systems comprise plasma etch and/or deposition modules, a transfer chamber, and a vacuum load lock or cassette station. Transfer chambers including handling robot are available with three to six ports. Up to two cassette stations can be used to increase the throughput.
Flexibility and modularity
SENTECH Cluster Configurations can be used to process a large variety of substrates from 100 mm wafers up to 200 mm in diameter.
The systems offer different levels of automation ranging from vacuum cassette loading to a one-process chamber for up to a six-port cluster configuration, with different etch and deposition modules offering high flexibility and high throughput.
All SENTECH Cluster Systems are controlled by advanced hardware and SIA operating software, with a client-server architecture. A well-proven, reliable programmable logic controller (PLC) is used for the real-time control of all components.
Configurations:
High-throughput cluster for production
This example is configured with two cassette stations, 3 inductively coupled plasma (ICP) process modules and one port for later upgrading to add a further process module.
- Flexibility using carrier handling
(pieces, 100 mm, 150 mm, 200 mm) - Combining processes without breaking vacuum
- Multiple process modules for ICP-RIE, ALE,
DRIE, cryo etching, ICPECVD, and PEALD - Separating chemically incompatible processes
